Home » Qualcomm reveals Snapdragon 845 Specs and Features

Qualcomm reveals Snapdragon 845 Specs and Features

Written By Zen Estacio
Published • December 7th, 2017
MobileNews
0

Qualcomm officially announced yesterday, the arrival of their latest flagship mobile platform — the Snapdragon 845. Today, the company unveiled what’s under the hood of the Snapdragon 845 including the new features it will bring into the mobile computing world.

Qualcomm’s Snapdragon chips are not just processors but rather a complete platform for internal hardware which include modems, GPU’s, camera modules, WiFi units and more. As such the new Snapdragon chip will include new and improved graphics in the form of Adreno’s 630 GPU, an updated Qualcomm Spectra 280 image signal processor (ISP), a new AI system, the latest Snapdragon X20 LTE modem and the Kryo 385 CPU, among others.

The new Adreno 630 enables devices to capture 64x higher dynamic range color information for video capture and playback on Ultra HD displays. It also has improved color depth for better 4K/Ultra HD video viewing. Qualcomm updated the chips AI and biometric security system by implementing smarter voice commands and adding a secure processing unit (SPU).

As for connectivity, the Snapdragon 845’s X20 LTE modem supports the LTE Cat 18 category bringing with it peak downloads of1.2Gbps, up to 5x carrier aggregation, License Assisted Access (LAA), Dual SIM-Dual VoLTE, and 4×4 MIMO.

Check out more details about the Snapdragon 845’s specs and features below.

Qualcomm Spectra 280 ISP

Ultra HD premium capture
Qualcomm Spectra Module Program, featuring Active Depth Sensing
MCTF video capture
Multi-frame noise reduction
High-performance capture up to 16MP @60FPS
Slow motion video capture (720p @480 fps)
ImMotion computational photography

Adreno 630 Visual Processing Subsystem

30% improved graphics/video rendering and power reduction compared to the previous generation
Room-scale 6 DoF with SLAM
Adreno foveation, featuring tile rendering, eye tracking, multiView rendering, fine grain preemption
2K x 2K @ 120Hz, for 2.5x faster display throughput
Improved 6DoF with hand-tracking and controller support

Qualcomm® Hexagon™ 685 DSP

3^rd Generation Hexagon Vector DSP (HVX) for AI and imaging
3^rd Generation Qualcomm All-Ways Aware^TM Sensor Hub
Hexagon scalar DSP for audio

Snapdragon X20 LTE Modem

Support for 1.2 Gbps Gigabit LTE Category 18
License Assisted Access (LAA)
Citizens Broadband Radio Service (CBRS) shared radio spectrum
Dual SIM-Dual VoLTE (DSDV)

Connectivity

Multigigabit 11ad Wi-Fi with diversity module
Integrated 2×2 11ac Wi-Fi with Dual Band Simultaneous (DBS) support
11k/r/v: Carrier Wi-Fi enhanced mobility, fast acquisition, and congestion mitigation
Bluetooth 5 with proprietary enhancements for ultra-low power wireless earbud support and direct audio broadcast to multiple devices

Secure Processing Unit

Biometric authentication (fingerprint, iris, voice, face)
User and app data protection
Integrated use-cases such as integrated SIM, Payments, and more

Qualcomm Aqstic Audio

Qualcomm Aqstic audio codec(WCD934x):

Playback:

Dynamic range: 130dB, THD+N: -109dB
Native DSD support (DSD64/DSD128), PCM up to 384kHz/32bit
Low power voice activation: 0.65mA

Record:

Dynamic range: 109dB, THD+N: -103dB
Sampling: Up to 192kHz/24bit

Qualcomm® Quick Charge™ 4+

Kryo 385 CPU

Four performance cores up to 2.8GHz (25 percent performance uplift compared to the previous generation)
Four efficiency cores up to 1.8GHz
2MB shared L3 cache (new)
3MB system cache (new)

10-nanometer (nm) LPP FinFET process technology

source: Qualcomm

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Zen Estacio

Zen Estacio is a Multimedia Producer for YugaTech. He is the team's laptop guru and one of their resident gamers. He has a monthly column compiling the latest and greatest the Nintendo Switch has to offer. Aside from that, he regularly writes gaming news, reviews, and impressions. You can hit him up at @papanZEN