Xiaomi confirms July 22 launch, teases “steel metal” build

Xiaomi sends out media invitations for its grand product launch to happen on July 22, 2014. A teaser posted earlier shows a big “4” while the invite talks about a “journey of a piece of steel,” hinting on a metal build on its upcoming flagship phone – most likely the Xiaomi Mi 4.

Building on the success of the Mi 3, the Mi 4 is rumored to come with a Qualcomm Snapdragon 801 or 805 processor under a 5.2-inch Full HD display. A 3GB RAM is also expected to support the device along with 16GB of internal storage. In addition, the Mi 4 will allegedly sport a 16-megapixel rear shooter and support for LTE bands.

As teased by Xiaomi itself, steel metal will play a huge role in this new device so we’re looking forward to a metal build better than the Mi 3’s. For comparison, you may check out the specs of Xiaomi’s current flagship below.

Xiaomi Mi 3 specs:
5-inch Full HD IPS display, 441ppi
Gorilla Glass 3
2.3GHz Qualcomm Snapdragon 800 quad-core CPU
Adreno 330GPU
2GB RAM
16GB internal storage
13 megapixel rear camera w/ dual LED flash
2 megapixel front camera
HSPA+, 3G
WiFi 802.11 a/b/g/n/ac, WiFi Direct
NFC
Bluetooth 4.0 w/ A2DP
GPS, AGPS, GLONASS
USB OTG
3,050mAh battery
MIUI v5 (Android 4.4.2 KitKat)
144 x 73.6 x 8.1mm (dimensions)
145 grams (weight)
Php10,599USD 181INR 15,311EUR 172CNY 1,315

Watch this space as we get more concrete details on the specifications of the Mi 4.

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