MediaTek has announced the Dimensity 8300 as its latest addition to its 8000-series of midrange chipsets. Harnessing the second-generation TSMC 4-nanometer process, the new system-on-chip (SoC) brings significant performance boost over its predecessor, the Dimensity 8200.
The Dimensity 8300 has eight Arm CPU cores based on Armv9 CPU architecture. It consists of 4x Cortex-A715 performance cores with a max clock speed of 3.35GHz and 4x Cortex-A510 efficiency cores at up to 2.2GHz. These bring up to 20% faster CPU performance or 30% peak gains in power efficiency, according to MediaTek.
GPU gets upgraded to Arm Mali-G615 MC6 GPU boasting 60% greater peak performance or 55% improved power efficiency at peak speeds over its previous iteration.
Dimensity 8300 brings on-device generative AI to the table through its next-generation APU 780 AI processor. This enables full support for large language models (LLM) with up to 10 billion parameters as well as stable diffusion.
RAM and storage capabilities got an upgrade with up to 8,533Mbps LPDDR5x and UFS 4.0 with Multi-Circular Queue (MCQ), respectively.
For imaging capabilities, its 14-bit HDR Imagiq 980 image signal processor (ISP) enables HDR 4K video recording at 60fps and supports up to 320-megapixel camera sensors.
Connectivity-wise, the Dimensity 8300 now has Wi-Fi 6E and Bluetooth 5.4 connectivity. And an integrated 5G modem with 3CC carrier aggregation that enables up to 5.17Gbps downlink speeds on sub-6GHz band.
Devices equipped with the new chip will hit the market before the year ends. Xiaomi’s sub-brand Redmi already announced that its Redmi K70E 41 powered by the Dimensity 8300 will debut later this month.
MediaTek Dimensity 8300 Infographics
