MediaTek has just unveiled an all-new chipset for flagship 5G phones called the MediaTek Dimensity 9200+.
The Dimensity 9200+ will combine one ultra-core Arm Cortex-X3 operating at up to 3.35 GHz, three Arm Cortex-A715 super cores that will run up to 3.0 GHz, and four Arm Cortex-A510 efficiency cores that operate at 2.0 GHz.
In addition, the 11-core Arm Immortalis-G715 GPU in the 9200+ will be boosted by 17%.
According to MediaTek, the 9200+ performs 10% and 5% faster on GeekBench 6.0’s single and multi-core tests compared to last year’s Dimensity 9200.
The 9200+ will have a 4CC-CA 5G Release-16 modem that MediaTek says can fluidly switch between long-reach sub-6GHz and mmWave connections. The chip will also feature Wi-Fi 7 2×2 + 2×2 and Bluetooth 5.3.
Other key features of the 9200+ include its HyperEngine 6.0 gaming technology, Second Generation TSMC 4nm-class process, and a 6th Generation AI Processing Unit (APU 690) for AI tasks.
The chip manufacturer says that they expect smartphones powered by the MediaTek Dimensity 9200+ to be released in May 2023.
