MediaTek has unveiled today the Dimensity 9400 flagship SoC. Built on a cutting-edge 3-nm process, it promises big performance leaps across the board from its predecessor.
The main highlights include a more powerful, more efficient CPU and GPU, a new Image Signal Processor (ISP), and 8th Gen Neural Processing Unit (NPU).
The Dimensity 9400 is built on TSMC’s second-generation 3-nm process (N3E) promising up to 40% more power-efficiency. This should translate to longer battery life.
For CPU architecture, the chip uses ‘all big core design’ boasting one Cortex-X925 super-performance core at 3.62GHz, three Cortex-X4 cores at 3.3GHz, and four Cortex-A720 efficiency cores at 2.4GHz.
MediaTek claims up to 35% faster single-core performance and 28% gain for multi-cores.
On the subject of memory, the Dimensity 9400 is the first chip on the market that enables up to 10.7 Gbps bandwidth through LPDDR5x RAM. Then, the L2 cache is increased by 100% and the L3 cache by 50%.
For GPU, it runs on 1612MHz Arm Immortalis-G925 bringing up to 41% faster peak performance, 40% faster ray-tracing performance, and 44% more power efficient.
Its 8th Generation NPU (NPU 890) highlights faster and better performance related to generative AI as well as 35% gain in power efficiency.
The Imagiq 1090 ISP enables HDR video recording for entire zoom range supposedly making it possible to switch zoom levels without any drop in quality.
Based on previous reports, the first smartphones to debut the Dimensity 9400 are the vivo X200 Series and the OPPO Find X8. They are expected to launch soon this October.
