MediaTek has today introduced its latest innovations in mobile processing technology with the announcement of the Dimensity 7300 and Dimensity 7300X chipsets. These ultra-efficient 4nm chips are designed to deliver top-tier power efficiency and exceptional performance, targeting high-tech mobile applications.
The Dimensity 7300 chipsets are engineered for smooth multitasking, superior photography, accelerated gaming, and advanced AI-enhanced computing. Notably, the Dimensity 7300X is optimized for flip-style foldable devices, offering robust support for dual displays.
Both chipsets feature an octa-core CPU with 4 Arm Cortex-A78 cores clocked up to 2.5GHz and 4 Arm Cortex-A55 cores. Leveraging the 4nm process, the new CPUs achieve up to 25% lower power consumption in the A78 cores compared to the previous Dimensity 7050. This configuration works in tandem with the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimizations to enhance gaming performance, boasting 20% faster frame rates and 20% improved energy efficiency over competitor alternatives. Additional gaming enhancements include smart resource optimization, optimized 5G and Wi-Fi game connections, and support for Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
“The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”
In terms of photography, the Dimensity 7300 series is equipped with the MediaTek Imagiq 950, which includes a high-end 12-bit HDR-ISP supporting a 200MP main camera. It features advanced hardware engines for precise noise reduction, face detection, and video HDR, enabling users to capture stunning images and videos in any lighting condition. The chipsets enhance live focus photo performance by up to 1.3 times and photo remastering by up to 1.5 times faster than the Dimensity 7050. Additionally, 4K HDR video recording is improved with over 50% wider dynamic range compared to competitors, capturing more details in videos.
The MediaTek APU 655 significantly boosts AI task efficiency, doubling the performance of the Dimensity 7050. It also supports new mixed precision data types to optimize memory bandwidth and reduce memory requirements for larger AI models.
MediaTek’s MiraVision 955, integrated within the Dimensity 7300 SoCs, supports WFHD+ displays with 10-bit true color and global HDR standards, enhancing media streaming and playback quality. The Dimensity 7300X further supports dual displays for flip phones, meeting the rising market demand for innovative device form factors.
Key features of the Dimensity 7300 and 7300X also include:
- MediaTek 5G UltraSave 3.0+ technology, offering up to 30% greater power efficiency in common 5G sub-6GHz connectivity scenarios compared to competitors.
- Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, delivering faster speeds in urban and suburban areas.
- Tri-band Wi-Fi 6E support for fast, reliable multi-gigabit wireless connectivity.
- Dual 5G SIM support with dual VoNR for enhanced user choice.
The Dimensity 7300 and 7300X chipsets are set to redefine the performance standards for high-tech mobile devices, pushing the boundaries of efficiency, connectivity, and user experience.
These new set of features are set to be put in the next generation of mobile devices says MediaTek.
